Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13145163
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Filing Dt:
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07/19/2011
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Publication #:
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Pub Dt:
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11/10/2011
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Inventors:
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Kenichiro Sugimori, Seiji Yamada, Satoshi Kawakubo, Atsushi Irisawa
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Title:
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LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 487, SEKIYADOMOTOMACHI, |
| NODA-CITY CHIBA, JAPAN |
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| 32-1, SENJU ASAHI-CHO, ADACHI-KU, |
| TOKYO, JAPAN |
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| KRATZ, QUINTOS & HANSON, LLP |
| 4TH FLOOR |
| 1420 K STREET, N.W. |
| WASHINGTON, DC 20005 |
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