Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12780444
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Filing Dt:
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05/14/2010
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Publication #:
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Pub Dt:
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11/17/2011
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Inventors:
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Jenq-Gong Duh, Chien-Fu Tseng
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Title:
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COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 101, SEC. 2, KUANG FU RD. |
| HSINCHU CITY, TAIWAN |
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| JOE MCKINNEY MUNCY |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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