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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/03/2013
Application #:
13003451
Filing Dt:
08/16/2011
Publication #:
Pub Dt:
12/01/2011
Inventor:
Vincent Mevellec
Title:
METHOD FOR REPAIRING COPPER DIFFUSION BARRIER LAYERS ON A SEMICONDUCTOR SOLID SUBSTRATE AND REPAIR KIT FOR IMPLEMENTING THIS METHOD
Assignment: 1
Reel/Frame:
026761/0793Recorded: 08/16/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/25/2011
Assignee:
15 RUE DU BUISSON AUX FRAISES - Z.I. DE LA BONDE
MASSY, FRANCE 91300
Correspondent:
HAMRE, SCHUMANN, MUELLER & LARSON, P.C.
P.O. BOX 2902
MINNEAPOLIS MN 55402-0902

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