Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/19/2013
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Application #:
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13105658
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Filing Dt:
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05/11/2011
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Publication #:
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Pub Dt:
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12/01/2011
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Inventors:
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You Wang, Wen-Chiang Tu, Feng Q. Liu, Yuchun Wang, Lakshmanan Karuppiah et al
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Title:
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CHEMICAL PLANARIZATION OF COPPER WAFER POLISHING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATTERSON & SHERIDAN, L.L.P. |
| 3040 POST OAK BLVD, SUITE 1500 |
| HOUSTON, TX 77056 |
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