Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/24/2014
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Application #:
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13114141
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Filing Dt:
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05/24/2011
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Publication #:
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Pub Dt:
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12/01/2011
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Inventors:
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Kyohei KOUTAKE, Hiromichi Morita, Fumiyoshi Kano, Tetsuji Yamaguchi, Sumitomo Inomata et al
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Title:
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WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| POSZ LAW GROUP, PLC |
| 12040 SOUTH LAKES DRIVE |
| SUITE 101 |
| RESTON, VA 20191 |
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