Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/22/2014
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Application #:
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13138425
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Filing Dt:
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08/12/2011
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Publication #:
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Pub Dt:
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12/08/2011
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Inventors:
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Takeo Kuramoto, Kaichi Tsuruta, Takeo Saitou
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Title:
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SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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| MICHAEL TOBIAS |
| 1629 K ST NW |
| SUITE 300 |
| WASHINGTON DC 20006 |
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