Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/11/2014
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Application #:
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13142002
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Filing Dt:
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06/29/2011
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Publication #:
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Pub Dt:
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12/08/2011
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Inventors:
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Keisuke Yamanishi, Kengo Kaminaga, Ryo Fukuchi
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Title:
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Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6-3, OTEMACHI 2-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-8164 |
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WILLIAM BAK, HOWSON & HOWSON LLP |
501 OFFICE CENTER DRIVE |
SUITE 210 |
FORT WASHINGTON, PA 19034 |
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Assignment:
2
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1-2, OTEMACHI 1-CHOME, CHIYODA-KU, |
TOKYO,, JAPAN |
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CPA GLOBAL LTD |
LIBERATION HOUSE |
CASTLE STREET |
ST HELIER, JE1 1BL JERSEY |
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