Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13202674
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Filing Dt:
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08/22/2011
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Publication #:
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Pub Dt:
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12/15/2011
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Inventors:
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Hirohisa Dejima, Masakazu Kawata, Masahiro Yoneyama, Toyosei Takahashi et al
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Title:
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SEMICONDUCTOR WAFER BONDING PRODUCT, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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| BIRCH, STEWART, KOLASCH, & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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