Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13217239
|
Filing Dt:
|
08/24/2011
|
|
Publication #:
|
|
Pub Dt:
|
12/15/2011
| | | | |
|
Inventors:
|
Rajendra D. Pendse, Flynn Carson, Il Kwon Shim, Seng Guan Chow
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
|
|
|
|
| LAW OFFICES OF MIKIO ISHIMARU |
| 2055 GATEWAY PLACE |
| SUITE 700 |
| SAN JOSE, CA 95110 |
|
|
Search Results as of:
05/23/2024 04:13 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
