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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/10/2013
Application #:
13167140
Filing Dt:
06/23/2011
Publication #:
Pub Dt:
12/29/2011
Inventors:
Chikage NORITAKE, Tsuyoshi Arai, Naoki Hiraiwa
Title:
PRODUCTION METHOD OF SEMICONDUCTOR MODULE WITH RESIN-MOLDED ASSEMBLY OF HEAT SPREADER AND SEMICONDUCTOR CHIP
Assignment: 1
Reel/Frame:
026739/0836Recorded: 08/03/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/04/2011
Exec Dt:
07/05/2011
Exec Dt:
07/19/2011
Assignee:
1-1, SHOWA-CHO
KARIYA-CITY, AICHI-PREF., JAPAN 448-8661
Correspondent:
MICHELLE N. LESTER
NIXON & VANDERHYE P.C.
901 NORTH GLEBE ROAD
11TH FLOOR
ARLINGTON, VA 22203

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