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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13169918
Filing Dt:
06/27/2011
Publication #:
Pub Dt:
01/05/2012
Inventors:
Shinya Yokoyama, Satoshi Waga, Atsushi Tondokoro, Tadashi Sakashita, Sumihito Morita et al
Title:
HUMIDITY SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
026507/0828Recorded: 06/27/2011Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Assignee:
1-7 YUKIGAYA-OTSUKAMACHI, OTA-KU
TOKYO, JAPAN
Correspondent:
GUSTAVO SILLER, JR.
BRINKS, HOFER, GILSON & LIONE
P.O. BOX 10395
CHICAGO, IL 60610

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