Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/19/2012
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Application #:
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12835291
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Filing Dt:
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07/13/2010
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Publication #:
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Pub Dt:
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01/19/2012
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Inventors:
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Yoshitaka SASAKI, Hiroyuki Ito, Hiroshi Ikejima, Atsushi Iijima
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Title:
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LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| SAE TECHNOLOGY CENTRE |
| 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK |
| SHATIN, N.T., HONG KONG, CHINA |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 91 AMELIA STREET |
| TORONTO, CANADA M4X 1E5 |
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| LAUNCHIP LLC |
| 6009 W PARKER RD, STE 149 - 1045 |
| PLANO, TX 75093 |
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