Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13184078
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Filing Dt:
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07/15/2011
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Publication #:
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Pub Dt:
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01/26/2012
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Inventor:
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Sadamichi TAKAKUSAKI
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Title:
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CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FOIL PROVIDED WITH INSULATING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HAMMA BUILDING - 3RD FLOOR |
| 1 LANE HILL |
| HAMILTON, BERMUDA HM 19 |
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| TAKAMITSU FUJIU |
| C/O MORRISON & FOERSTER LLP |
| 1650 TYSONS BLVD |
| MCLEAN, VA 22102 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| AVENUE DE LA GARE 2 |
| FRIBOURG, SWITZERLAND 1700 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 EAST MCDOWELL ROAD |
| A700 |
| PHOENIX, AZ 85008 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 EAST MCDOWELL ROAD |
| A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 EAST MCDOWELL ROAD |
| A700 |
| PHOENIX, AZ 85008 |
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