Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/09/2013
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Application #:
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12844959
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Filing Dt:
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07/28/2010
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Publication #:
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Pub Dt:
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02/02/2012
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Inventors:
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Chih-Chin Liao, Cheeman Yu, Ya Huei Lee
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Title:
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SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED DIE AND EFFICIENT WIRE BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 601 MCCARTHY BOULEVARD |
| MILPITAS, CALIFORNIA 95035 |
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| VIERRA MAGEN MARCUS & DENIRO LLP |
| 575 MARKET STREET |
| SUITE 2500 |
| SAN FRANCISCO, CA 94105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6900 NORTH DALLAS PARKWAY |
| TWO LEGACY TOWN CENTER |
| PLANO, TEXAS 75024 |
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| SANDISK CORPORATION |
| 601 MCCARTHY BOULEVARD |
| PATENT DEPARTMENT/SIMONA BENJAMIN |
| MILPITAS, CA 95035 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 6900 DALLAS PARKWAY |
| SUITE 325 |
| PLANO, TEXAS 75024 |
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| SANDISK |
| 951 SANDISK DRIVE |
| PATENT DEPARTMENT/SIMONA BENJAMIN |
| MILPITAS, CA 95035 |
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