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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/26/2013
Application #:
13278152
Filing Dt:
10/20/2011
Publication #:
Pub Dt:
02/09/2012
Inventors:
Denver Paul C. CASTILLO, Rodel MANALAC, Pang Hup ONG, Bryan Soon Hua TAN, Kian Teng ENG et al
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES
Assignment: 1
Reel/Frame:
031474/0601Recorded: 10/24/2013Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/12/2009
Exec Dt:
01/12/2009
Exec Dt:
01/12/2009
Exec Dt:
01/12/2009
Exec Dt:
01/12/2009
Exec Dt:
01/12/2009
Exec Dt:
01/12/2009
Exec Dt:
01/12/2009
Exec Dt:
01/12/2009
Assignees:
5 SERANGOON NORTH AVENUE 5
SINGAPORE, SINGAPORE 554916
GUSTAV-HEINEMANN-RING 212
MUNICH, GERMANY 81739
Correspondent:
HORIZON IP PTE. LTD.
7500A BEACH ROAD #04-306/308
THE PLAZA
SINGAPORE, 199591 SINGAPORE

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