Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13264625
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Filing Dt:
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10/14/2011
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Publication #:
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Pub Dt:
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02/16/2012
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Inventors:
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Tsutomu Sasaki, Shinichi Terashima, Masamoto Tanaka, Katsuichi Kimura
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Title:
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LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN 1010021 |
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| 158-1, OAZA SAYAMAGAHARA, IRUMA-SHI, |
| SAITAMA, JAPAN 3580032 |
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| LOUIS J. DELJUIDICE |
| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET |
| WASHINGTON, DC 20001 |
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