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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13181278
Filing Dt:
07/12/2011
Publication #:
Pub Dt:
03/01/2012
Inventors:
Jen-Chuan Chen, Hui-Shan Chang, Wen-Hsiung Chang, Wei-Nung Chang
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
026624/0988Recorded: 07/20/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2011
Exec Dt:
06/10/2011
Exec Dt:
06/14/2011
Exec Dt:
06/13/2011
Assignee:
NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondent:
GEORGE D. MORGAN
4635 S LAKESHORE DR.
TEMPE, AZ 85282

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