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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/02/2014
Application #:
13264330
Filing Dt:
11/14/2011
Publication #:
Pub Dt:
03/01/2012
Inventor:
Akio Okamoto
Title:
MULTILAYER MOLDING APPARATUS AND MULTILAYER MOLDING METHOD
Assignment: 1
Reel/Frame:
027219/0613Recorded: 11/14/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/30/2011
Assignee:
1980, AZA OKINOYAMA
OAZA KOGUSHI, UBE-SHI
YAMAGUCHI, JAPAN 755-8633
Correspondent:
JAMES R. FOLEY
150 NORTH MICHIGAN AVENUE
SUITE 2700
CHICAGO, IL 60601

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