Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2013
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Application #:
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13252879
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Filing Dt:
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10/04/2011
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Publication #:
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Pub Dt:
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03/01/2012
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Inventors:
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Hideji Tajima, Osamu Segawa, Yukiko Miyashita
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Title:
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SAMPLE ARRAYING/ASSEMBLING DEVICE, ITS METHOD, AND APPARATUS USING SAMPLE ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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88, KAMIHONGOU |
MATSUDO-SHI, CHIBA, JAPAN 271-0064 |
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ALAN N. HERDA |
HAYNES AND BOONE, LLP |
2323 VICTORY AVENUE, SUITE 700 |
DALLAS, TX 75219 |
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