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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12877796
Filing Dt:
09/08/2010
Publication #:
Pub Dt:
03/08/2012
Inventors:
Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Keat Chuan Ng
Title:
LEAD FRAME PACKAGE WITH MULTIPLE BENDS
Assignment: 1
Reel/Frame:
024963/0185Recorded: 09/09/2010Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/08/2010
Exec Dt:
09/08/2010
Exec Dt:
09/08/2010
Assignee:
NO. YISHUN AVE. 7
SINGAPORE, SINGAPORE 768923
Correspondent:
AVAGO TECHNOLOGIES LIMITED
NO. YISHUN AVE. 7
SINGAPORE, 768923 SINGAPORE
Assignment: 2
Reel/Frame:
028968/0296Recorded: 09/17/2012Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/09/2012
Exec Dt:
07/09/2012
Exec Dt:
07/09/2012
Assignee:
511 SAMSEONG-RO, GANGNAM-GU
GOLDEN TOWER 10TH FLOOR
SEOUL, KOREA, REPUBLIC OF 135-090
Correspondent:
SUNWOO LEE
1030 15TH STREET, NW
SUITE 380 EAST
WASHINGTON, DC 20005

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