Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/07/2015
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Application #:
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13213730
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Filing Dt:
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08/19/2011
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Publication #:
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Pub Dt:
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03/08/2012
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Inventors:
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Eun Sung Lee, Sang Soo Jee, Kun Mo Chu, Se Yun Kim, Kyu Hyoung Lee, Sang Mock Lee
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Title:
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HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDING A JUNCTION PART MADE OF THE HEAT DISSIPATION MATERIAL
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416, MAETAN-DONG, |
YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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HARNESS, DICKEY & PIERCE, P.L.C. |
P.O. BOX 8910 |
RESTON, VA 20195 |
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