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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/30/2013
Application #:
13178919
Filing Dt:
07/08/2011
Publication #:
Pub Dt:
03/08/2012
Inventors:
Sun-Ha Hwang, Young-Soo Park, Sam-Jong Choi, Joon-Young Choi, Tae-Hyoung Koo
Title:
Wafer, Fabricating Method Of The Same, And Semiconductor Substrate
Assignment: 1
Reel/Frame:
026567/0969Recorded: 07/08/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Exec Dt:
06/17/2011
Assignee:
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
GARY D. YACURA
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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