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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8283781
Issue Dt:
10/09/2012
Application #:
12879512
Filing Dt:
09/10/2010
Publication #:
20120061823
Pub Dt:
03/15/2012
Inventors:
Wei-Cheng WU, Shang-Yun HOU, Shin-Puu JENG, Tzuan-Horng LIU, Tzu-Wei CHIU, Chao-Wen Shih
Title:
SEMICONDUCTOR DEVICE HAVING PAD STRUCTURE WITH STRESS BUFFER LAYER
Assignment: 1
Reel/Frame:
025549/0944Recorded: 12/22/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WU, WEI-CHENG
Exec Dt:
12/13/2010
HOU, SHANG-YUN
Exec Dt:
12/13/2010
JENG, SHIN-PUU
Exec Dt:
12/14/2010
LIU, TZUAN-HORNG
Exec Dt:
12/13/2010
CHIU, TZU-WEI
Exec Dt:
12/13/2010
SHIH, CHAO-WEN
Exec Dt:
12/14/2010
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA, VA 22314

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