Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/18/2013
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Application #:
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12888761
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Filing Dt:
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09/23/2010
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Publication #:
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Pub Dt:
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03/29/2012
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Inventors:
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Stefan Kolb, Bernhard Winkler, Ivo Rangelow, Hans-Olof Blom, Johan Bjurstroem
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Title:
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METHOD FOR FORMING A THROUGH VIA IN A SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT COMPRISING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| ESCHWEILER & ASSOCIATES LLC |
| 629 EUCLID AVENUE, SUITE 1000 |
| NATIONAL CITY BUILDING |
| CLEVELAND, OH 44114 |
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