Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13248225
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Filing Dt:
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09/29/2011
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Publication #:
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Pub Dt:
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04/05/2012
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Inventors:
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James R. Gillen, Adam Rowen, Christian Arrington
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Title:
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Forming Through-Substrate Vias by Electrofilling
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1515 EUBANK SE |
| ALBUQUERQUE, NEW MEXICO 87123-0161 |
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| KERRY KAMPSCHMIDT |
| SANDLA NATIONAL LABORATORIES |
| INTELLECTUAL PROPERTY CENTER, 11500 |
| P.O. BOX 5800 |
| ALBUQUERQUE, NEW MEXICO 87185-0161 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 1000 INDEPENDNCE AVE., SW |
| WASHINGTON, DISTRICT OF COLUMBIA 20585 |
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| BRENDA K. BANKS |
| 1000 INDEPENDENCE AVE. |
| WASHINGTON, DC 20585 |
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