Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/16/2013
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Application #:
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13006639
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Filing Dt:
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01/14/2011
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Publication #:
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Pub Dt:
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04/26/2012
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Inventors:
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HUNG-CHIH LIN, Mill-Jer WANG, CHING-NEN PENG, HAO CHEN
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Title:
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TEST STRUCTURES FOR THROUGH SILICON VIAS (TSVs) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN HAM & BERNER, LLP (TSMC) |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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