Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12910087
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Filing Dt:
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10/22/2010
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Publication #:
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Pub Dt:
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04/26/2012
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Inventors:
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Tetsuo SATO, Nobuyoshi MATSUURA, Hiroki ANDO
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Title:
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POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2880 SCOTT BOULEVARD |
| SANTA CLARA, CALIFORNIA 95050-2554 |
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| CAMPBELL STEPHENSON LLP |
| 11401 CENTURY OAKS TERRACE |
| BUILDING H; SUITE 250 |
| AUSTIN, TX 78758 |
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