Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/19/2013
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Application #:
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12943281
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Filing Dt:
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11/10/2010
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Publication #:
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Pub Dt:
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05/10/2012
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Inventors:
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Jung-Huei PENG, Hsin-Ting HUANG, Yao-Te HUANG, Shang-Ying TSAI, Ping-Yin LIU
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Title:
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METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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DUANE MORRIS LLP (TSMC) IP DEPARTMENT |
30 SOUTH 17TH STREET |
PHILADELPHIA, PA 19103-4196 |
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