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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12945625
Filing Dt:
11/12/2010
Publication #:
Pub Dt:
05/17/2012
Inventors:
MAHENDRA CHHABRA, Kang Sub Yim, Alexandros T. Demos
Title:
PROCESS FOR LOWERING ADHESION LAYER THICKNESS AND IMPROVING DAMAGE RESISTANCE FOR THIN ULTRA LOW-K DIELECTRIC FILM
Assignment: 1
Reel/Frame:
026101/0826Recorded: 04/07/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/08/2011
Exec Dt:
02/07/2011
Exec Dt:
02/08/2011
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
B. TODD PATTERSON
PATTERSON & SHERIDAN, LLP
3040 POST OAK BLVD, SUITE 1500
HOUSTON, TX 77056

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