Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13296630
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Filing Dt:
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11/15/2011
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Publication #:
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Pub Dt:
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05/17/2012
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Inventors:
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Kazuaki Matsumoto, Satoshi Katayama
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Title:
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CURABLE COMPOSITION, HEAT CONDUCTIVE RESIN MOLDED PRODUCT AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4, NAKANOSHIMA 3-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA, JAPAN 530-8288 |
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| EDWARDS WILDMAN PALMER LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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Assignment:
2
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| 2-3-18, NAKANOSHIMA, KITA-KU |
| OSAKA, JAPAN |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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