Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/13/2012
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Application #:
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12954121
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Filing Dt:
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11/24/2010
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Publication #:
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Pub Dt:
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05/24/2012
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Inventors:
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Chih-Horng Chang, Yian-Liang Kuo, Chih-Hang Tung, Tsung-Fu Tsai
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Title:
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THERMAL GRADIENT REFLOW FOR FORMING COLUMNAR GRAIN STRUCTURES FOR SOLDER BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| STEVEN H. SLATER |
| 17950 PRESTON ROAD, SUITE 1000 |
| SLATER & MATSIL L.L.P. |
| DALLAS, TX 75252 |
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