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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13118171
Filing Dt:
05/27/2011
Publication #:
Pub Dt:
05/31/2012
Inventors:
Rajmohan Bhandari, Sandeep Negi, Florian Solzbacher, Richard A. Normann
Title:
WAFER-SCALE NEEDLE ARRAY
Assignment: 1
Reel/Frame:
027229/0117Recorded: 11/15/2011Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/18/2011
Exec Dt:
07/18/2011
Exec Dt:
10/10/2011
Exec Dt:
07/21/2011
Assignee:
201 SOUTH PRESIDENTS CIRCLE
SALT LAKE CITY, UTAH 84112
Correspondent:
ERIK S. ERICKSEN
8180 S. 700 E., SUITE 350
THORPE NORTH & WESTERN, LLP
SANDY, UT 84070
Assignment: 2
Reel/Frame:
027229/0169Recorded: 11/15/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/10/2011
Assignee:
615 ARAPEEN DRIVE, SUITE 310
SALT LAKE CITY, UTAH 84108
Correspondent:
ERIK S. ERICKSEN
8180 S. 700 E., SUITE 350
THORPE NORTH & WESTERN, LLP
SANDY, UT 84070

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