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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13320998
Filing Dt:
02/01/2012
Publication #:
Pub Dt:
05/31/2012
Inventors:
Shintarou Hayashi, Mitsuhiko Ueda, Yoshiharu Sanagawa, Takamasa Sakai
Title:
MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
Assignment: 1
Reel/Frame:
027632/0203Recorded: 02/01/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/07/2011
Exec Dt:
11/07/2011
Exec Dt:
11/07/2011
Exec Dt:
11/07/2011
Assignee:
1048, OAZA-KADOMA
KADOMA-SHI, OSAKA, JAPAN 571-8686
Correspondent:
EDWARDS WILDMAN PALMER LLP
P.O. BOX 55874
BOSTON, MA 02205
Assignment: 2
Reel/Frame:
027697/0525Recorded: 02/13/2012Pages: 21
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/01/2012
Assignee:
1006 OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8501
Correspondent:
PANASONIC PATENT CENTER
1130 CONNECTICUT AVE., N.W., SUITE 1100
WASHINGTON, DC 20036

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