Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13396334
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Filing Dt:
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02/14/2012
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Publication #:
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Pub Dt:
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06/14/2012
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Inventors:
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Kengo Kaminaga, Terumasa Moriyama
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Title:
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Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1, TORANOMON 2-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-0001 |
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| WILLIAM BAK, HOWSON & HOWSON LLP |
| 501 OFFICE CENTER DRIVE |
| SUITE 210 |
| FORT WASHINGTON, PA 19034 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 10-1, TORANOMON 2-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-0001 |
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| WILLIAM BAK, HOWSON & HOWSON LLP |
| 501 OFFICE CENTER DRIVE |
| SUITE 210 |
| FORT WASHINGTON, PA 19034 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8164 |
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| WILLIAM BAK, HOWSON & HOWSON LLP |
| 501 OFFICE CENTER DRIVE |
| SUITE 210 |
| FORT WASHINGTON, PA 19034 |
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