Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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13411990
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Filing Dt:
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03/05/2012
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Publication #:
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Pub Dt:
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06/28/2012
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Inventors:
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Kai Liu, Lei Shi, Jun Lu, Anup Bhalla
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Title:
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DUAL-LEADFRAME MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 495 MERCURY DRIVE |
| SUNNYVALE, CALIFORNIA 94085 |
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| CHEIN-HWA S. TSAO |
| 6684 MT PAKRON DRIVE |
| SAN JOSE, CA 95120 |
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