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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/16/2014
Application #:
13163989
Filing Dt:
06/20/2011
Publication #:
Pub Dt:
06/28/2012
Inventors:
Shunichi Wakayanagi, Takayuki Saito, Takuya Seino, Akira Matsuo, Koji Yamazaki et al
Title:
ELECTRONIC COMPONENT MANUFACTURING METHOD INCLUDING STEP OF EMBEDDING METAL FILM
Assignment: 1
Reel/Frame:
026956/0854Recorded: 09/23/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/22/2011
Exec Dt:
07/22/2011
Exec Dt:
07/26/2011
Exec Dt:
08/31/2011
Exec Dt:
07/26/2011
Exec Dt:
07/19/2011
Exec Dt:
08/30/2011
Exec Dt:
07/15/2011
Exec Dt:
07/13/2011
Assignee:
2-5-1 KURIGI, ASAO-KU
KAWASAKI-SHI, JAPAN 215-8550
Correspondent:
FITZPATRICK, CELLA, HARPER & SCINTO
1290 AVENUE OF THE AMERICAS
17TH FLOOR
NEW YORK, NY 10104

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