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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/24/2014
Application #:
13235372
Filing Dt:
09/17/2011
Publication #:
Pub Dt:
07/05/2012
Inventors:
Eun-Kyoung CHOI, SeYoung JEONG, Kwang-chul CHOI, Tae Hong MIN, Chungsun LEE et al
Title:
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
026923/0440Recorded: 09/17/2011Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/29/2011
Exec Dt:
08/29/2011
Exec Dt:
08/29/2011
Exec Dt:
08/29/2011
Exec Dt:
08/29/2011
Exec Dt:
08/29/2011
Assignee:
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
HOSOON LEE
9600 SW OAK ST. SUITE 525
TIGARD, OR 97223

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