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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8816485
Issue Dt:
08/26/2014
Application #:
13352424
Filing Dt:
01/18/2012
Publication #:
20120175721
Pub Dt:
07/12/2012
Inventors:
Chris Apanius, Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal
Title:
Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding
Assignment: 1
Reel/Frame:
027557/0164Recorded: 01/19/2012Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
APANIUS, CHRISTOPHER
Exec Dt:
01/09/2008
SHICK, ROBERT A.
Exec Dt:
01/04/2008
NG, HENDRA
Exec Dt:
01/03/2008
BELL, ANDREW
Exec Dt:
01/03/2008
ZHANG, WEI
Exec Dt:
01/03/2008
NEAL, PHILLIP S.
Exec Dt:
01/02/2008
Assignee:
PROMERUS LLC
9921 BRECKSVILLE ROAD
BUILDING R
BRECKSVILLE, OHIO 44141
Correspondent:
PAUL M. REZNICK
420 FT. DUQUESNE BLVD., SUITE 1200
ONE GATEWAY CENTER
PITTSBURGH, PA 15222
Assignment: 2
Reel/Frame:
032213/0679Recorded: 02/13/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
PROMERUS, LLC
Exec Dt:
02/13/2014
Assignee:
SUMITOMO BAKELITE CO., LTD.
5-8, HIGASHI-SHINAGAWA, 2-CHROME SHINAGAWA-KU
TOKYO, JAPAN 140-0002
Correspondent:
THE WEBB LAW FIRM
ONE GATEWAY CTR, 420 FT DUQUESNE BLVD
SUITE 1200
PITTSBURGH, PA 15222

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