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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13303938
Filing Dt:
11/23/2011
Publication #:
Pub Dt:
07/19/2012
Inventors:
Joon Yong PARK, Yong Seok HAN, Jae Jun LEE, Chul Ho JEONG
Title:
METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
027336/0170Recorded: 12/06/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/19/2011
Exec Dt:
09/19/2011
Exec Dt:
09/19/2011
Exec Dt:
09/19/2011
Assignee:
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
CANTOR COLBURN LLP
20 CHURCH STREET
HARTFORD, CT 06103

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