Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/17/2014
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Application #:
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13008845
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Filing Dt:
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01/18/2011
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Publication #:
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Pub Dt:
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07/19/2012
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Inventors:
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Bin XIE, Pui Chung Simon LAW, Yat Kit TSUI
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Title:
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FORMING THROUGH-SILICON-VIAS FOR MULTI-WAFER INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3/F, BUILDING 6 |
| 2 SCIENCE PARK WEST AVENUE |
| SHATIN, NEW TERRITORIES, HONG KONG |
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| ELLA CHEONG HONG KONG |
| 5001 HOPEWELL CENTRE, 183 QUEEN'S ROAD E |
| WAN CHAI, HONG KONG |
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