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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13353874
Filing Dt:
01/19/2012
Publication #:
Pub Dt:
07/26/2012
Inventors:
Toshihiro WAKI, Toru ISHIKAWA
Title:
DEVICE ALLOWING SUPPRESSION OF STRESS ON CHIP
Assignment: 1
Reel/Frame:
027566/0268Recorded: 01/20/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/12/2012
Exec Dt:
01/12/2012
Assignee:
2-1, YAESU 2-CHOME, CHUO-KU
TOKYO, JAPAN 104-0028
Correspondent:
FOLEY AND LARDNER LLP
3000 K STREET NW
WASHINGTON, MD 20007
Assignment: 2
Reel/Frame:
032901/0196Recorded: 05/15/2014Pages: 134
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/26/2013
Assignee:
208, VAL DES BONS MALADES
LUXEMBOURG, LUXEMBOURG L-2121
Correspondent:
CONVERSANT INTELLECTUAL PROPERTY MGMT
5700 GRANITE PARKWAY
SUITE 960
PLANO, TX 75024

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