Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/25/2014
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Application #:
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13498992
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Filing Dt:
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03/29/2012
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Publication #:
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Pub Dt:
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07/26/2012
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Inventors:
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Ryo Suzuki, Hiroshi Takamura
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Title:
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Hybrid Silicon Wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8164 |
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| WILLIAM BAK, HOWSON & HOWSON LLP |
| 501 OFFICE CENTER DRIVE |
| SUITE 210 |
| FORT WASHINGTON, PA 19034 |
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Assignment:
2
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| 1-2, OTEMACHI 1-CHOME, CHIYODA-KU, |
| TOKYO,, JAPAN |
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| CPA GLOBAL LTD |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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