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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/22/2013
Application #:
13442546
Filing Dt:
04/09/2012
Publication #:
Pub Dt:
08/02/2012
Inventors:
Sang Won Yoon, Koji Shiozaki
Title:
COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D) INTEGRATION AND METHOD OF MANUFACTURING
Assignment: 1
Reel/Frame:
028014/0749Recorded: 04/09/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/31/2010
Exec Dt:
03/31/2010
Assignee:
25 ATLANTIC AVENUE
ERLANGER, KENTUCKY 41018
Correspondent:
SNELL & WILMER LLP (OC)
600 ANTON BOULEVARD
SUITE 1400
COSTA MESA, CA 92626
Assignment: 2
Reel/Frame:
031582/0549Recorded: 11/12/2013Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/22/2013
Assignee:
1 TOYOTA-CHO
TOYOTA AICHI, JAPAN 471-8571
Correspondent:
KETAN S. VAKIL
600 ANTON BLVD SUITE 1400
COSTA MESA, CA 92626

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