Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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13019280
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Filing Dt:
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02/01/2011
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Publication #:
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Pub Dt:
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08/02/2012
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Inventors:
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Yifan Zhang, Gary K. Yeap, Yonghua Liao, Dalei Wang
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Title:
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TWO-CHIP CO-DESIGN AND CO-OPTIMIZATION IN THREE-DIMENSIONAL INTEGRATED CIRCUIT NET ASSIGNMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 700 EAST MIDDLEFIELD RD., BLDG. C |
| MOUNTAIN VIEW, CALIFORNIA 94043 |
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| BEVER, HOFFMAN & HARMS, LLP |
| 901 CAMPISI WAY |
| SUITE 370 |
| CAMPBELL, CA 95008 |
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