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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/20/2015
Application #:
13326103
Filing Dt:
12/14/2011
Publication #:
Pub Dt:
08/09/2012
Inventors:
SE RA KIM, HYO SOOK JOO, SUK KY CHANG, JUNG SUP SHIM
Title:
WAFER PROCESSING SHEET
Assignment: 1
Reel/Frame:
036261/0398Recorded: 08/05/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/20/2012
Exec Dt:
04/20/2012
Exec Dt:
04/20/2012
Exec Dt:
04/20/2012
Assignee:
128, YEOUI-DAERO, YEONGDEUNGPO-GU,
SEOUL, KOREA, REPUBLIC OF 150-721
Correspondent:
DENTONS US LLP
1900 K STREET NW
WASHINGTON, DC 20006

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