Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13028814
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Filing Dt:
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02/16/2011
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Publication #:
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Pub Dt:
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08/16/2012
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Inventors:
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FUAD E. DOANY, BENJAMIN G. LEE, CLINT L. SCHOW
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Title:
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FLIP-CHIP PACKAGING FOR DENSE HYBRID INTEGRATION OF ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| TUTUNJIAN & BITETTO, P.C. |
| 425 BROADHOLLOW ROAD, SUITE 302 |
| MELVILLE, NY 11747 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 3701 NORTH FAIRFAX DRIVE |
| ARLINGTON, VIRGINIA 22203-1714 |
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| KIMBERLY DOWNEY |
| OFFICE OF GENERAL COUNSEL |
| 3701 NORTH FAIRFAX DRIVE |
| ARLINGTON, VA 22203-1714 |
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