Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13468862
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Filing Dt:
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05/10/2012
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Publication #:
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Pub Dt:
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08/30/2012
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Inventors:
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Chih-Feng Huang, Chiu-Chih Chiang, You-Kuo Wu, Lih-Ming Doong
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Title:
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MULTI-CHIP MODULE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F, NO. 205-3, SEC. 3, BEISHIN ROAD |
| SHIN-DIAN CITY |
| TAIWAN, TAIWAN |
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| BERLINER & ASSOCIATES |
| 555 WEST FIFTH STREET |
| 31ST FLOOR |
| LOS ANGELES, CA 90013 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 6F-1, NO. 3 YUANQU STREET, NANGANG DISTRICT |
| TAIPEI CITY, TAIWAN 115 |
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| BRAKE HUGHES BELLERMANN LLP |
| C/O CPA GLOBAL, P.O. BOX 52050 |
| MINNEAPOLIS, MN 55402 |
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