Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13200161
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Filing Dt:
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09/20/2011
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Publication #:
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Pub Dt:
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11/01/2012
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Inventors:
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Hsi-Chen Yang, Ya-Tzu Wu
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Title:
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Integrated circuit chip package and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F, NO. 20, TAI YUEN STREET |
| CHUPEI CITY, HSIN-CHU, TAIWAN |
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| RANDY W. TUNG, TUNG & ASSOCIATES |
| 838 W LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MI 48302 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER FOR 13/200,161. PREVIOUSLY RECORDED ON REEL 027307 FRAME 0839. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF APPLICATION # 13/200,161 TO RICHTEK TECHNOLOGY CORPORATION, R.O.C..
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| 5F, NO. 20, TAI YUEN STREET |
| CHUPEI CITY, HSIN-CHU, TAIWAN |
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| RANDY W. TUNG, TUNG & ASSOCIATES |
| 838 W LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MI 48302 |
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