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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/30/2014
Application #:
13190721
Filing Dt:
07/26/2011
Publication #:
Pub Dt:
11/08/2012
Inventors:
Cheng Ping Liu, Tsung Hsien Lin, Hsien Te Chen, Chih Wei Liao
Title:
RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
Assignment: 1
Reel/Frame:
026655/0369Recorded: 07/27/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/15/2011
Exec Dt:
07/14/2011
Exec Dt:
07/14/2011
Exec Dt:
07/15/2011
Assignee:
NO. 803, PO AI ST.
CHUPEI CITY, HSINCHU COUNTY, TAIWAN
Correspondent:
GREER, BURNS & CRAIN, LTD.
300 SOUTH WACKER DRIVE
SUITE 2500
CHICAGO, IL 60606

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