Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/30/2013
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Application #:
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13560786
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Filing Dt:
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07/27/2012
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Publication #:
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Pub Dt:
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11/15/2012
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Inventors:
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François Hébert, Anup Bhalla, Kai Liu, Ming Sun
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Title:
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METHOD FOR MAKING SOLDER-TOP ENHANCED SEMICONDUCTOR DEVICE OF LOW PARASITIC PACKAGING IMPEDANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CANNONS COURT 22 , VICTORIA STREET |
| HAMILTON, BERMUDA HM12 |
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| CHEIN-HWA S. TSAO |
| 6684 MT PAKRON DRIVE |
| SAN JOSE, CA 95120 |
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